Dry Film Lamination Txheej txheem yog dab tsi?

Cov txheej txheem ntawm cov zaj duab xis qhuav lamination suav nrog kev siv lub siab, nrog rau cov cua sov, kom ruaj khov rau cov yeeb yaj kiab polymer qhuav rau lub substrate los yog saum npoo ntawm microstructure, uas ua rau muaj ntau txheej txheej los yog qhov kawg encapsulation ntawm cov cuab yeej. Dab tsi hauv qab no yog ib qho hauv - qhov tob tob piav qhia txog cov txheej txheem txheej txheem, ntau yam kev thov, cov txiaj ntsig, thiab kev ua haujlwm tseem ceeb:
Principle of Process: Typically, dry film is made up of three distinct layers: a polyester coating (PET, serving as the external protective layer), a photoresist coating (the central layer, the core substance, responsive to certain ultraviolet light wavelengths; areas not exposed dissolve in the developer, whereas those exposed experience a cross-linking reaction leading to insolubility), and a polyethylene kev tiv thaiv txheej (PE, txheej sab hauv, kov lub substrate thaum lamination, thiab tshem tawm ua ntej lossis thaum lub sij hawm lamination). Thaum lub sij hawm lamination txheej txheem, lub tshuab laminator qhuav, zoo li Roller Laminator, yog ua haujlwm. Thaum pib, cov txheej tiv thaiv polyethylene ntawm cov zaj duab xis qhuav, thaum dov, raug tshem tawm. Tom qab ntawd, nyob rau hauv ib puag ncig lub tshuab nqus tsev, cov chais kub siv cov zaj duab xis qhuav rau pristine, finely etched, thiab textured tooj liab puag, siv qhov kub thiab txias (feem ntau ntawm 100-130℃kom soften cov nplaum), pressures (xws li ntawm 0.4-0.8 MPa los tiv thaiv huab cua 5 m-3 / min), cov khoom siv). Swift txias tom qab ua rau cov txheej qhuav kom khov thiab ua raws.
Daim ntawv thov Scenarios: PCB (Printed Circuit Board) Qhuav: Qhuav zaj duab xis lamination yog feem ntau siv nyob rau hauv daim teb no. Hauv thaj tsam ntawm PCB ntau lawm, cov txheej txheem no ua lub luag haujlwm tseem ceeb hauv kev hloov cov qauv. Siv cov txheej txheej txheej txheej txheej txheej txheej txheej txheej txheej txheej txheej txheej tooj liab pristine tooj liab txheej txheej rau kev nthuav tawm ntxiv, kev txhim kho, thiab ntau yam txheej txheem. Ua haujlwm ib ntus raws li "txheej txheej tiv thaiv," cov yeeb yaj kiab qhuav tau lees tias qhov etching lossis electroplating cuam tshuam tsuas yog cov cheeb tsam uas xav tau rau kev tsim. As an illustration, this method finds application in creating high-density interconnect (HDI) boards for smartphone motherboards and 5G modules, and also in constructing multilayer boards and packaging materials (specifically ultra-fine circuits needed for chip packaging, where linewidths<=10μm demand sophisticated techniques).
Kev tsim tawm ntawm Microfluidic chips: Abgrall thiab cov npoj yaig hauv xyoo 2005 tau tsim ib txoj hauv kev tsim khoom rau 3D microfluidic tes hauj lwm, tag nrho tsim los ntawm SU-8 thiab koom nrog electrodes. Cov txheej txheem tau piav qhia tau yooj yim rau kev tsim cov yeeb yaj kiab tsis sib txuas SU-8 qhuav ntawm polyester (PET) nplooj ntawv, ua raws li lamination los tsim cov microstructures kaw, ua kom pom qhov ua tiav qhuav tso tawm ntawm polymer microstructures thiab tsim cov pliable microfluidic chips. Txoj kev siv cov cuab yeej siv yooj yim thiab tsis siv cov khoom siv sib txuas wafer, xaiv hloov mus rau kev tsom mus rau lamination ntau dua.
Cov txiaj ntsig thiab cov yam ntxwv: Qhov tseeb tshaj plaws: Qhov tuab tuab ntawm cov yeeb yaj kiab qhuav cuam tshuam rau qhov tseeb ntawm etching; cov thicknesses ntau yam los ntawm 15-40μm, ua tiav cov kev xav tau nruj nruj ntawm PCB ntau lawm thiab lwm yam kev siv.Ntxiv mus, los ntawm kev nplua -tuning ntawm cov txheej txheem tsis, nws muaj peev xwm ua tau ultra-thin qhuav zaj duab xis (tsawg dua 10μm) rau HDI nplua kab.Concurrently, qhov kev sib xyaw ua ke ntawm cov tshuab ziab khaub ncaws (DI) kev sib xyaw ua ke ntawm cov tshuab laser. yuam kev hauv cov yeeb yaj kiab, yog li txhim kho qhov tseeb ntawm cov qauv hloov pauv.
Kev ruaj ntseg zoo: Cov zaj duab xis qhuav ua kom pom kev ruaj khov rau hauv cov substrate nyob rau hauv cov txheej txheem tsim nyog, ua tiav kev kuaj kab xev thiab averting tev nyob rau hauv nws txoj kev loj hlob theem. Tsis tas li ntawd, cov txheej txheem lamination yuav siv qhov chaw nyob rau hauv lub tshuab nqus tsev, yog li tiv thaiv kev tsim ntawm npuas, tswj kev sib luag lamination kev ncaj ncees, thiab txo cov teeb meem zoo li tsis txaus.
Pab tau rau ib puag ncig: Qhuav zaj duab xis lamination, nyob rau hauv sib piv rau cov txheej txheem ntub dej, obviates qhov tsim nyog rau cov organic solvents nyob rau hauv txheej thiab ziab, yog li txo cov volatile organic compound (VOC) emissions thiab txhim kho nws ib puag ncig tus phooj ywg.
Cov ntsiab lus tseem ceeb ntawm kev ua haujlwm:
Kev npaj ntawm Substrate: Nws yuav tsum tau ua tib zoo tu cov txheej txheem xws li tshuaj ntxuav, txhuam hniav, sandblasting, thiab lwm yam.thiab cov txheej txheem ntawm micro-etching yog ua haujlwm los tshem tawm oxide txheej, roj, thiab plua plav tawm ntawm qhov chaw ntawm cov ntawv ci tooj liab, ua raws li kev ntxhib los mos kom muaj txiaj ntsig zoo ntawm daim ntawv cog lus ntawm cov ntaub ntawv qhuav.
Kev Tswj Xyuas Cov Tsis Txaus: Nws yog ib qho tseem ceeb rau kev ua kom zoo zoo - hloov cov txheej txheem sib txawv (xws li kub, siab, ceev) kom haum rau qhov loj ntawm cov substrate thiab hom qhuav zaj duab xis. Cov kub kub, piv txwv li, tuaj yeem ua rau wrinkling, npuas tsim, thinning nyob rau hauv tej cheeb tsam, thiab diminished adhesion los ntawm overrying; {2} conversely, tsis tshua muaj kub yuav ua rau txo adhesion thiab qis filling muaj peev xwm.Qhov kev sib raug zoo ntawm cov zaj duab xis qhuav thiab substrate yog cuam tshuam los ntawm fluctuating siab, thiab lub xub ntiag ntawm qhov khoob los yog khawb ntawm lub siab rollers kuj cuam tshuam qhov adhesion ntawm lub board nto thiab cov zaj duab xis qhuav nplaum.
Specifications rau Ib puag ncig: Txhawm rau tiv thaiv cov plua plav thiab impurities los ntawm kev cuam tshuam rau lamination zoo, thaj chaw ua haujlwm yuav tsum ua raws li kev cai huv huv (Class 100K lossis qis dua).Concurrently, nws yog ib qho tseem ceeb kom khaws cov zaj duab xis qhuav nyob rau hauv qhov chaw txias thiab tsis muaj paug nyob hauv tsev, steering ntshiab ntawm tshuaj lom neeg thiab radioactive cia.Cov xwm txheej rau kev cia nyob rau hauv ib cheeb tsam ntawm 7 lub teeb (dej kub thiab txias). 5-21℃yog qhov zoo tshaj plaws ntau yam), thiab cov av noo nyob ze 50%. Cov khoom siv tau yuav tsum raug txwv rau qhov siab tshaj plaws ntawm rau lub hlis tom qab- ntau lawm; Txawm li cas los xij, cov yeeb yaj kiab uas ua kom pom tseeb tom qab kev tsim khoom tseem siv tau.